gap filling material with a thermal

conductivity of 3.0 W/m-K. The material

offers exceptional thermal performance at

low pressures due to a unique 3.0 W/m-K

filler package and low-modulus resin

formulation. The enhanced material is

ideal for applications requiring low stress

on components and boards during

conformable nature that allows for quick

recovery and excellent wet-out

characteristics, even to surfaces with high

roughness and/or topography.

inherent tack on both sides of the material,

eliminating the need for thermally-

impeding adhesive layers. The top side

has minimal tack for ease of handling.

protective liners on both sides.

Note: To build a part number, visit our

website at www.bergquistcompany.com.

TYPICAL APPLICATIONS INCLUDE

• Telecommunications

• ASICs and DSPs

• Consumer electronics

• Thermal modules to heat sinks

CONFIGURATIONS AVAILABLE

• Sheet form and die-cut parts

PDS_GP_HC 3_0415

FEATURES AND BENEFITS

• Thermal Conductivity: 3.0 W/m-K

• High-compliance, low compression stress

• Fiberglass reinforced for shear and

tear resistance

PRODUCT DESCRIPTION

High-Compliance, Thermally Conductive,

Low Modulus Material

April 2015

PROPERTY

IMPERIAL VALUE

METRIC VALUE

TEST METHOD

Color

Blue

Blue

Visual

Reinforcement Carrier

Fiberglass

Fiberglass

—

Thickness (inch) / (mm)

0.020 to 0.125

0.508 to 3.175

ASTM D374

Inherent Surface Tack

2

2

—

Density (Bulk Rubber) (g/cc)

3.1

3.1

ASTM D792

Heat Capacity (J/g-K)

1.0

1.0

ASTM E1269

Hardness (Bulk Rubber) (Shore 00) (4)

15

15

ASTM D2240

Young's Modulus (psi) / (kPa) (1)

16

110

ASTM D575

Typical UseTemp (°F) / (°C)

-76 to 392

-60 to 200

—

ELECTRICAL

Dielectric BreakdownVoltage (Vac) (3)

5000

5000

ASTM D149

Dielectric Constant (1000 Hz)

6.5

6.5

ASTM D150

Volume Resistivity (Ohm-meter)

ASTM D257

Flame Rating

V-O

V-O

U.L. 94

THERMAL

Thermal Conductivity (W/m-K) (2)

3.0

3.0

ASTM D5470

THERMAL PERFORMANCE vs. STRAIN

Deflection (% strain)

10

20

30

0.57

0.49

0.44

compression at 10% strain on a 1mm thickness material.

2) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are

provided for reference only. Actual application performance is directly related to the surface roughness, flatness and

pressure applied.

3) Minimum value at 20 mil.

4) Thirty second delay value on Shore 00 hardness scale.

TYPICAL PROPERTIES OF GAP PAD HC 3.0

.25

.50

.75

1.00

1.25

1.50 1.75 2.00

140

120

100

80

60

40

20

0

Thickness vs. Thermal Resistance

Gap Pad HC 3.0