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GP-A2000 bảng dữ liệu(PDF) 1 Page - List of Unclassifed Manufacturers

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Giải thích chi tiết về linh kiện  Thermal conductivity: 2.0 W/m-K
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GP-A2000 bảng dữ liệu(HTML) 1 Page - List of Unclassifed Manufacturers

  GP-A2000 Datasheet HTML 1Page - List of Unclassifed Manufacturers GP-A2000 Datasheet HTML 2Page - List of Unclassifed Manufacturers  
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Gap Pad® A2000 acts as a thermal
interface and electrical insulator between
electronic components and heat sinks.
In the thickness range of 10 to 40 mil,
Gap Pad® A2000 is supplied with natural
tack on both sides, allowing for excellent
compliance to the adjacent surfaces of
components.The 40 mil material
thickness is supplied with lower tack on
one side, allowing for burn-in processes
and easy rework.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
Gap Pad® A2000
TYPICAL APPLICATIONS INCLUDE
• Computer and peripherals; between CPU and heat spreader
• Telecommunications
• Heat pipe assemblies
• RDRAM™ memory modules
• CDROM / DVD cooling
• Areas where heat needs to be transferred to a frame chassis
or other type of heat spreader
• DDR SDRAM memory modules
CONFIGURATIONS AVAILABLE
• Sheet form, die-cut parts, and roll form (converted or unconverted)
PDS_GP_A2000_0711
FEATURES AND BENEFITS
• Thermal conductivity: 2.0 W/m-K
• Fiberglass reinforced for puncture, shear
and tear resistance
• Electrically isolating
PRODUCT DESCRIPTION
High Performance,Thermally Conductive
Gap Filling Material
July 2011
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color
Gray
Gray
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010 to 0.040
0.254 to 1.016
ASTM D374
Inherent Surface Tack (1 side)
2
2
—
Density (Bulk Rubber) (g/cc)
2.9
2.9
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness (BulkRubber) (Shore 00) (1)
80
80
ASTM D2240
Young's Modulus (psi) / (kPa) (2)
55
379
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric BreakdownVoltage (Vac)
>4000
>4000
ASTM D149
Dielectric Constant (1000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
2.0
2.0
ASTM D5470
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
10
20
30
Thermal Impedance (°C-in2/W) 0.040" (3)
1.04
1.00
0.95
1) Thirty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min.step rate of strain
with a sample size of 0.79 inch2. 3) The ASTM D5470 test fixture was used.The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL PROPERTIES OF GAP PAD A2000
0.20
0.30
0.50
0.40
0.70
0.60
0.80
40
35
30
25
20
15
10
0
Thickness vs. Thermal Resistance
Gap Pad A2000
Thermal Resistance (C-in2/W)


Số phần tương tự - GP-A2000

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
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List of Unclassifed Man...
GP-A3000 ETC2-GP-A3000 Datasheet
480Kb / 2P
Thermal conductivity: 2.6 W/m-K
More results

Mô tả tương tự - GP-A2000

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
logo
List of Unclassifed Man...
GP-3500ULM ETC2-GP-3500ULM Datasheet
368Kb / 2P
Thermal Conductivity: 3.5 W/m-K
GP-A3000 ETC2-GP-A3000 Datasheet
480Kb / 2P
Thermal conductivity: 2.6 W/m-K
GP-EMI1.0 ETC2-GP-EMI1.0 Datasheet
589Kb / 2P
Thermal Conductivity: 1.0 W/m-K
GP-HC3.0 ETC2-GP-HC3.0 Datasheet
441Kb / 2P
Thermal Conductivity: 3.0 W/m-K
GP-HC1000 ETC2-GP-HC1000 Datasheet
482Kb / 2P
Thermal conductivity: 1.0 W/m-K
GP-VO ETC2-GP-VO Datasheet
439Kb / 2P
Thermal conductivity: 0.8 W/m-K
GP-VOSOFT ETC2-GP-VOSOFT Datasheet
475Kb / 2P
Thermal conductivity: 0.8 W/m-K
GP-VOULTRASOFT-B ETC2-GP-VOULTRASOFT-B Datasheet
376Kb / 2P
Thermal conductivity: 1.0 W/m-K
SP-2000 ETC2-SP-2000 Datasheet
398Kb / 2P
High thermal conductivity: 3.5 W/m-K
SP-A2000 ETC2-SP-A2000 Datasheet
396Kb / 2P
High thermal conductivity: 3.0 W/m-K
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