TLV62565, TLV62566

SLVSBC1C – OCTOBER 2013 – REVISED JULY 2015

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8 Specifications

8.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN, EN,PG

–0.3

7

V

SW

–0.3

V

FB

–0.3

3.6

V

PG

660

µA

Continuous total power dissipation

See Thermal Information

–40

150

°C

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

8.2 ESD Ratings

VALUE

UNIT

±2000

V

Electrostatic

discharge

±500

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

(1)

MIN

TYP

MAX

UNIT

Input voltage, VIN

2.7

5.5

V

Operating ambient temperature

–40

85

°C

(1)

Refer to the Application and Implementation section for further information.

8.4 Thermal Information

TLV62565, TLV62566

UNIT

DBV (5 Pins)

Junction-to-ambient thermal resistance

208.3

Junction-to-case (top) thermal resistance

73.7

Junction-to-board thermal resistance

36.1

°C/W

Junction-to-top characterization parameter

2.3

Junction-to-board characterization parameter

35.3

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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