LM2695

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SNVS413A – JANUARY 2006 – REVISED APRIL 2013

If it is expected that the internal dissipation of the LM2695 will produce excessive junction temperatures during

normal operation, good use of the PC board’s ground plane can help considerably to dissipate heat. The

exposed pad on the bottom of the IC package can be soldered to a ground plane, and that plane should extend

out from beneath the IC, and be connected to ground plane on the board’s other side with several vias, to help

dissipate the heat. The exposed pad is internally connected to the IC substrate. Additionally the use of wide PC

board traces, where possible, can help conduct heat away from the IC. Judicious positioning of the PC board

within the end product, along with the use of any available air flow (forced or natural convection) can help reduce

the junction temperatures.

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