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PIC16LC554 bảng dữ liệu(PDF) 83 Page - Microchip Technology

tên linh kiện PIC16LC554
Giải thích chi tiết về linh kiện  EPROM-Based 8-Bit CMOS Microcontroller
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© 1997 Microchip Technology Inc.
Preliminary
DS40143B-page 83
PIC16C55X(A)
Plastic Small Outline Family
Notes:
1.
Controlling parameter: inches.
2.
All packages are gull wing lead form.
3.
"D" and "E" are reference datums and do not include mold flash or protrusions. Mold flash or protrusions shall
not exceed .006 package ends and .010 on sides.
4.
The chamfer on the body is optional. If it is not present, a visual index feature must be located within the
cross-hatched area to indicate pin 1 position.
5.
Terminal numbers are shown for reference.
Symbol List for Small Outline Package Parameters
Symbol
Description of Parameters
α
Angular spacing between min. and max. lead positions measured at the gauge plane
A
Distance between seating plane to highest point of body
A1
Distance between seating plane and base plane
B
Width of terminals
C
Thickness of terminals
D
Largest overall package parameter of length
E
Largest overall package width parameter not including leads
e
Linear spacing of true minimum lead position center line to center line
H
Largest overall package dimension of width
L
Length of terminal for soldering to a substrate
N
Total number of potentially usable lead positions
CP
Seating plane coplanarity



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