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MIC7201 bảng dữ liệu(PDF) 5 Page - Micrel Semiconductor |
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MIC7201 bảng dữ liệu(HTML) 5 Page - Micrel Semiconductor |
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5 / 8 page ![]() December 1998 5 MIC7201 MIC7201 Micrel Symbol Parameter Condition Min Typ Max Units V OUT Output Voltage Swing output high, R L = 2k, 24 80 mV Note 10 specified as V V+ – VOUT 120 mV output low, R L = 2k 24 80 mV 120 mV output high, R L = 600Ω,80 mV specified as V V+ – VOUT mV output low, R L = 600Ω 80 mV mV I SC Output Short-Circuit Current sinking or sourcing, Note 6, Note 7 40 200 mA BW Bandwidth –3dB point 250 kHz SR Slew Rate 0.5 V/ µs THD Total Harmonic Distortion f = 1kHz 0.02 % f = 10kHz 0.02 % e n Input Referred Voltage Noise f = 1kHz 30 nV Hz / I S Supply Current no load 1.2 4.0 mA Internal Op Amp Typical Characteristics +2.2V ≤ V V+ ≤ 10V, VV– = 0V, VCM = VOUT = V+/2; RL = 1MΩ; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +85°C; unless noted Symbol Parameter Condition Min Typ Max Units V OS Input Offset Voltage 0.11 mV TCV OS Input Offset Voltage Drift 1.0 µV/°C I B Input Bias Current 1.0 pA I OS Input Offset Current 0.5 pA R IN Input Resistance >1 T Ω CMRR Common-Mode Rejection Ratio 0V ≤ V CM ≤ VV+ 80 dB V CM Input Common-Mode Voltage input low –0.3 V input high V V++0.3 V PSRR Power Supply Rejection Ratio V V+ = VV– = 1.1V to 1.65V, 60 dB V CM = 0V General Note: Devices are ESD protected; however, handling precautions are recommended. All limits guaranteed by testing or statistical analysis. Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside its recommended operating ratings. Note 2: I/O pin voltage is any external voltage to which an input or output is referenced. Note 3: The maximum allowable power dissipation is a function of the maximum junction temperature, T J(max); the junction-to-ambient thermal resistance, θ JA; and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: P D = (TJ(max) – TA) / θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature. Note 4: Thermal resistance, θ JA, applies to a part soldered on a printed-circuit board. Note 5: Human body model, 1.5k in series with 100pF. Note 6: Short circuit may cause the device to exceed maximum allowable power dissipation. See Note 3. Note 7: Shorting V OUT to V+ when V+ > 10V may damage the device. Note 8: Limited by internal bias-network resistors. Power supply must be “clean.” Power supply should be bypassed as shown in typical application circuit. Note 9: The gain error specification applies to differential, inverting, and noninverting gains. Note 10: Since the part is specified in a single-supply configuration, the output load (R L) is a Thevenin equivalent value. The actual load consists of 2 × R L to ground and 2 × RL to the supply (V+). |
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