MIC7111 datasheet(5/8 Pages) MICREL

5 / 8 page

June 1998

MIC7111

Micrel

Symbol

Parameter

Condition

Min

Typ

Max

Units

Input Bias Current

110

500

Input Offset Current

0.01

0.5

Input Resistance

>10

Ω

+PSRR

Positive Power Supply

≤ V

V+ ≤ 10V, VV– = 0V,

Rejection Ratio

CM = VOUT = 2.5V

–PSRR

Negative Power Supply

–5V

≤ V

V– ≤ –10V, VV+ = 0V,

Rejection Ratio

CM = VOUT = –2.5V

CMRR

Common-Mode Rejection Ratio

CM = –0.2V to +10.2V

Common Mode Input Capacitance

OUT

Output Voltage Swing

output high, R

L = 100k,

0.45

2.5

specified as V

V+ – VOUT

2.5

output low, R

L = 100k

0.45

2.5

output high, R

L = 2k,

specified as V

V+ – VOUT

120

output low, R

L = 2k

120

Output Short Circuit Current

sourcing, V

OUT = 0V

100

200

Note 6

sinking, V

OUT = 10V

100

200

VOL

Voltage Gain

sourcing

500

V/mV

sinking

500

V/mV

Supply Current

V+ = 10V, VOUT = VV+/2

µA

AC Electrical Characteristics (10V)

V+ = +10V, V– = 0V, V

CM = VOUT = VV+/2; RL = 1M; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +85°C; unless noted

Symbol

Parameter

Condition

Min

Typ

Max

Units

Slew Rate

voltage follower, 1V step, R

L = 100k@1.35V

0.02

µs

OUT = 1VP–P

GBW

Gain Bandwidth Product

kHz

Phase Margin

Gain Margin

Input Referred Voltage Noise

f = 1kHz, V

CM = 1.0V

110

nV/ Hz

Input Referred Current Noise

f = 1kHz

0.03

pA/ Hz

General Notes: Devices are ESD protected; however, handling precautions are recommended. All limits guaranteed by testing on statistical analysis.

Note 1:

Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when

operating the device outside its recommended operating ratings.

Note 2:

I/O Pin Voltage is any external voltage to which an input or output is referenced.

Note 3:

The maximum allowable power dissipation is a function of the maximum junction temperature, T

J(max); the junction-to-ambient thermal

resistance,

JA; and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using:

D = (TJ(max) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature.

Note 4:

Thermal resistance,

JA, applies to a part soldered on a printed-circuit board.

Note 5:

Human body model, 1.5k in series with 100pF.

Note 6:

Short circuit may cause the device to exceed maxium allowable power dissipation. See Note 3.

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