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MIC5237-2.5BU bảng dữ liệu(PDF) 3 Page - Micrel Semiconductor

tên linh kiện MIC5237-2.5BU
Giải thích chi tiết về linh kiện  500mA Low-Dropout Regulator Preliminary Information
PDF  8 Pages
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nhà sản xuất  MICREL [Micrel Semiconductor]
Trang chủ  http://www.micrel.com
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MIC5237-2.5BU bảng dữ liệu(HTML) 3 Page - Micrel Semiconductor

  MIC5237-2.5BU Datasheet HTML 1Page - Micrel Semiconductor MIC5237-2.5BU Datasheet HTML 2Page - Micrel Semiconductor MIC5237-2.5BU Datasheet HTML 3Page - Micrel Semiconductor MIC5237-2.5BU Datasheet HTML 4Page - Micrel Semiconductor MIC5237-2.5BU Datasheet HTML 5Page - Micrel Semiconductor MIC5237-2.5BU Datasheet HTML 6Page - Micrel Semiconductor MIC5237-2.5BU Datasheet HTML 7Page - Micrel Semiconductor MIC5237-2.5BU Datasheet HTML 8Page - Micrel Semiconductor  
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January 2000
3
MIC5237
MIC5237
Micrel
Electrical Characteristics
V
IN = VOUT + 1.0V; COUT = 4.7µF, IOUT = 100µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted.
Symbol
Parameter
Conditions
Min
Typical
Max
Units
V
OUT
Output Voltage Accuracy
variation from nominal V
OUT
–3
3
%
–5
5
%
∆V
OUT/∆T
Output Voltage
Note 2
40
ppm/
°C
Temperature Coefficient
∆V
OUT/VOUT
Line Regulation
V
IN = VOUT + 1V to 16V
0.05
%/V
0.015
0.1
%/V
∆V
OUT/VOUT
Load Regulation
I
OUT = 100µA to 500mA, Note 3
0.05
0.5
%
0.7
%
V
IN – VOUT
Dropout Voltage, Note 4
I
OUT = 100µA10
70
mV
90
mV
I
OUT = 50mA
115
190
mV
280
mV
I
OUT = 150mA
165
350
mV
450
mV
I
OUT = 500mA
300
600
mV
700
mV
I
GND
Ground Pin Current, Note 5
I
OUT = 100µA80
130
µA
170
µA
I
OUT = 50mA
350
650
µA
900
µA
I
OUT = 150mA
1.8
2.5
mA
3.0
mA
I
OUT = 500mA
8
15
mA
20
mA
PSRR
Ripple Rejection
f = 120Hz
75
dB
I
LIMIT
Current Limit
V
OUT = 0V
700
900
mA
1000
∆V
OUT/∆PD
Thermal Regulation
Note 6
0.05
%/W
e
no
Output Noise
V
OUT = 5.0V, IOUT = 50mA,
500
nV/ Hz
C
OUT = 2.2µF
Note 1:
Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when
operating the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction
temperature, T
J(max), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power
dissipation at any ambient temperature is calculated using: P
D(max) = (TJ(max) –TA) ÷ θJA. Exceeding the maximum allowable power dissipa-
tion will result in excessive die temperature, and the regulator will go into thermal shutdown. See the “Thermal Considerations” section for
details.
Note 2:
Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.
Note 3:
Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load
range from 100
µA to 500mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
Note 4:
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V
differential.
Note 5:
Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of
the load current plus the ground pin current.
Note 6:
Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line
regulation effects. Specifications are for a 500mA load pulse at V
IN = 16V for t = 10ms.



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