LM8850

SNVS647C – AUGUST 2010 – REVISED MAY 2013

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DESCRIPTION (CONTINUED)

High-switching frequency enables smaller passive components. Internal compensation is used for a broader

range of inductor and output capacitor values to meet system demand and achieve small system solution size.

LM8850 is available in a 9-bump ultra-thin DSBGA package. Only four external surface-mount components, a 1.0

µH inductor, a 4.7 µF for input capacitor, 4.7 µF for output capacitor and 0.05F-1.0F supercapacitor for energy

storage are required.

Connection Diagram

Figure 1. 9-Bump Ultra-Thin DSBGA Package

See Package Number YPD0009

PIN DESCRIPTIONS

Pin #

Name

Description

A1

VIN

Power Supply Input. Connect to input filter capacitor (See Typical Application

Circuit)

A2

SW

Switching node. Connection to the internal NFET switch and PFET synchronous

rectifier

A3

GND

Ground Pin

B1

SDA

Ω pull-up resistor)

B2

PG

Power Good indicator

B3

VOUT

Output pin.

C1

SCLK

Ω pull-up resistor)

C2

EN

Enable pin. The device is in shutdown when voltage to this pin is <0.4V and enabled

when >1.2V. Do not leave this pin floating.

C3

BAL

Balancing pin for active voltage balancing of supercapacitor

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

2

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