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LM2735XMF/NOPB bảng dữ liệu(PDF) 39 Page - Texas Instruments

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tên linh kiện LM2735XMF/NOPB
Giải thích chi tiết về linh kiện  LM2735-xx 520-kHz and 1.6-MHz Space-Efficient Boost and SEPIC DC-DC Regulator
PDF  59 Pages
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nhà sản xuất  TI [Texas Instruments]
Trang chủ  http://www.ti.com
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LM2735XMF/NOPB bảng dữ liệu(HTML) 39 Page - Texas Instruments

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4
FB
VIN
EN
PGND
AGND
SW
5
6
3
2
1
VIN
VO
PCB
PGND
COUT
CIN
L1
D1
CIN
L2
C6
LM2735, LM2735-Q1
www.ti.com
SNVS485G – JUNE 2007 – REVISED AUGUST 2015
Layout Examples (continued)
The layout guidelines described for the LM2735 Boost-Converter are applicable to the SEPIC Converter.
Figure 45 shows a proper PCB layout for a SEPIC Converter.
Figure 45. SEPIC PCB Layout
10.3 Thermal Considerations
When designing for thermal performance, one must consider many variables:
•
Ambient Temperature: The surrounding maximum air temperature is fairly explanatory. As the temperature
increases, the junction temperature will increase. This may not be linear though. As the surrounding air
temperature increases, resistances of semiconductors, wires and traces increase. This will decrease the
efficiency of the application, and more power will be converted into heat, and will increase the silicon junction
temperatures further.
•
Forced Airflow: Forced air can drastically reduce the device junction temperature. Air flow reduces the hot
spots within a design. Warm airflow is often much better than a lower ambient temperature with no airflow.
•
External Components: Choose components that are efficient, and you can reduce the mutual heating
between devices.
Copyright © 2007–2015, Texas Instruments Incorporated
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Product Folder Links: LM2735 LM2735-Q1



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