CHA2266

12.5-17GHz Driver Amplifier

Ref. : DSCHA22667082- 23 Mar 07

8/8

Specifications subject to change without notice

Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE

Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

Chip Assembly and Mechanical Data

Notes: Vd1 & Vd2 pads are internally connected

Supply feed should be bypassed. 25µm diameter gold wire is recommended

Bond pad positions and Pin references

(Chip thickness: 100 µm. all dimensions are in micrometers)

Dimensions : 2320 x 1020µm

± 35µm

Ordering Information

Chip Form

:

CHA2266-99F/00

Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors

S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of

patents or other rights of third parties which may result from its use. No license is granted by implication or

otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications

mentioned in this publication are subject to change without notice. This publication supersedes and replaces all

information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use

as critical components in life support devices or systems without express written approval from United

Monolithic Semiconductors S.A.S.

VD 1

VD 2

IN

OUT

Drain supply feed

100 pF