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LPC1759 bảng dữ liệu(PDF) 13 Page - NXP Semiconductors

tên linh kiện LPC1759
Giải thích chi tiết về linh kiện  32-bit ARM Cortex-M3 MCU; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN
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LPC1759_58_56_54_52_51
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 8.6 — 18 August 2015
13 of 80
NXP Semiconductors
LPC1759/58/56/54/52/51
32-bit ARM Cortex-M3 microcontroller
[1]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis. This pin is pulled up to a voltage level of 2.3 V to 2.6 V.
[2]
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input,
digital section of the pad is disabled and the pin is not 5 V tolerant. This pin is pulled up to a voltage level of 2.3 V to 2.6 V.
[3]
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled. This pin is pulled up to a voltage level of 2.3 V to 2.6 V.
[4]
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only). This pad is not 5 V tolerant.
[5]
5 V tolerant pad with 10 ns glitch filter providing digital I/O functions with TTL levels and hysteresis. This pin is pulled up to a voltage
level of 2.3 V to 2.6 V.
[6]
5 V tolerant pad with TTL levels and hysteresis. Internal pull-up and pull-down resistors disabled.
[7]
5 V tolerant pad with TTL levels and hysteresis and internal pull-up resistor.
[8]
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
[9]
Pad provides special analog functionality. 32 kHz crystal oscillator must be used with the RTC.
[10] When the system oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding
is preferred to reduce susceptibility to noise). XTAL2 should be left floating.
[11] When the RTC is not used, connect VBAT to VDD(REG)(3V3) and leave RTCX1 floating.
XTAL1
19[9][10]
I
Input to the oscillator circuit and internal clock generator circuits.
XTAL2
20[9][10]
O
Output from the oscillator amplifier.
RTCX1
13[9][11]
I
Input to the RTC oscillator circuit.
RTCX2
15[9]
O
Output from the RTC oscillator circuit.
VSS
24, 33,
43, 57,
66, 78
I
ground: 0 V reference.
VSSA
9I
analog ground: 0 V reference. This should nominally be the same voltage as VSS,
but should be isolated to minimize noise and error.
VDD(3V3)
21, 42,
56, 77
I
3.3 V supply voltage: This is the power supply voltage for the I/O ports.
VDD(REG)(3V3)
34, 67
I
3.3 V voltage regulator supply voltage: This is the supply voltage for the on-chip
voltage regulator only.
VDDA
8I
analog 3.3 V pad supply voltage: This should be nominally the same voltage as
VDD(3V3) but should be isolated to minimize noise and error. This voltage is used to
power the ADC and DAC. This pin should be tied to 3.3 V if the ADC and DAC are
not used.
VREFP
10
I
ADC positive reference voltage: This should be nominally the same voltage as
VDDA but should be isolated to minimize noise and error. Level on this pin is used
as a reference for ADC and DAC. This pin should be tied to 3.3 V if the ADC and
DAC are not used.
VREFN
12
I
ADC negative reference voltage: This should be nominally the same voltage as
VSS but should be isolated to minimize noise and error. Level on this pin is used as
a reference for ADC and DAC.
VBAT
16[11]
I
RTC pin power supply: 3.3 V on this pin supplies the power to the RTC
peripheral.
Table 4.
Pin description …continued
Symbol
Pin
Type
Description



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