UCD3138A datasheet(5/83 Pages) TI

5 / 83 page

UCD3138A

www.ti.com

SLUSC66B – MARCH 2015 – REVISED MAY 2015

Table of Contents

Device Overview

......................................... 1

6.7

Automatic Mode Switching

.......................... 36

1.1

Features

.............................................. 1

6.8

DPWMC, Edge Generation, IntraMux

............... 40

1.2

Applications

........................................... 2

6.9

Filter

................................................. 41

1.3

Description

............................................ 2

6.10

Communication Ports

............................... 46

1.4

Functional Block Diagram

............................ 3

6.11

Miscellaneous Analog

............................... 49

Revision History

......................................... 6

6.12

Package ID Information

............................. 49

Device Comparison

..................................... 7

6.13

Brownout

............................................ 49

3.1

Product Selection Matrix

............................. 7

6.14

Global I/O

........................................... 50

Terminal Configuration and Functions

.............. 8

6.15

Temperature Sensor Control

........................ 51

4.1

UCD3138ARGC Package

............................ 8

6.16

I/O Mux Control

..................................... 51

4.2

UCD3138ARMH Package

........................... 10

6.17

Current Sharing Control

............................. 51

Specifications

........................................... 12

6.18

Temperature Reference

............................. 52

5.1

Absolute Maximum Ratings

......................... 12

Application, Implementation, and Layout

......... 53

5.2

ESD Ratings

........................................ 12

7.1

Application Information

.............................. 53

5.3

Recommended Operating Conditions

............... 12

7.2

Typical Application

.................................. 54

5.4

Electrical Characteristics

............................ 13

7.3

Layout

............................................... 65

5.5

Thermal Characteristics

............................. 15

7.4

Power Supply Decoupling and Bulk Capacitors

.... 66

5.6

PMBus/SMBus/I2C Timing

.......................... 16

Device and Documentation Support

............... 67

5.7

Parametric Measurements Information

............. 17

8.1

Device Support

...................................... 67

5.8

Peripherals

.......................................... 18

8.2

Documentation Support

............................. 70

5.9

Typical Temperature Characteristics

................ 25

8.3

Trademarks

.......................................... 70

Detailed Description

................................... 26

8.4

Electrostatic Discharge Caution

..................... 71

6.1

Overview

............................................ 26

8.5

Export Control Notice

............................... 71

6.2

ARM Processor

..................................... 26

8.6

Glossary

............................................. 71

6.3

Memory

.............................................. 26

Mechanical Packaging and Orderable

Information

.............................................. 71

6.4

System Module

...................................... 28

9.1

Via Channel

......................................... 71

6.5

DPWM Modes of Operation

......................... 30

9.2

Packaging Information

.............................. 71

6.6

Sync FET Ramp and IDE Calculation

.............. 36

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