1

2

3

4

5

6

IN

OUT

IN_REF

INB

VCC

VEE

INB

VEE

IN

OUT

VCC

N/C

N/C

IN_REF

1

2

3

4

8

7

6

5

LM5112

SNVS234B – SEPTEMBER 2004 – REVISED APRIL 2006

www.ti.com

Pin Configurations

Figure 2. WSON-6

Figure 3. MSOP-PowerPAD-8

PIN DESCRIPTIONS

Pin

Name

Description

Application Information

WSON-6

MSOP-8

1

4

IN

Non-inverting input pin

TTL compatible thresholds. Pull up to VCC when not used.

2

3

VEE

Power ground for driver outputs

Connect to either power ground or a negative gate drive

supply for positive or negative voltage swing.

3

6

VCC

Positive Supply voltage input

Locally decouple to VEE. The decoupling capacitor should

be located close to the chip.

4

7

OUT

Gate drive output

Capable of sourcing 3A and sinking 7A. Voltage swing of

this output is from VEE to VCC.

5

1

IN_REF

Ground reference for control inputs

Connect to power ground (VEE) for standard positive only

output voltage swing. Connect to system logic ground when

VEE is connected to a negative gate drive supply.

6

2

INB

Inverting input pin

TTL compatible thresholds. Connect to IN_REF when not

used.

- - -

5, 8

N/C

Not internally connected

- - -

- - -

Exposed

Exposed Pad, underside of package

Internally bonded to the die substrate. Connect to VEE

Pad

ground pin for low thermal impedance.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

2

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