DXP

DXN

SCL

SDA

THERM

GND

V+

ALERT / THERM2

SMBus

Controller

1

2

3

4

5

8

7

6

TMP451-Q1

1.7V to 3.6V

1.7V to 3.6V

Overtemperature Shutdown

(2)

(2)

(2)

(2)

0.1µF

10k

(typ)

10k

(typ)

10k

(typ)

10k

(typ)

(3)

(3)

Transistor-connected configuration

(1)

Diode-connected configuration

(1)

Series Resistance

TMP451-Q1

SLOS877 – OCTOBER 2014

www.ti.com

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TMP451-Q1 device requires only a transistor connected between the D+ and D– pins for remote

temperature measurement. Tie the D+ pin to GND if the remote channel is not used and only the local

temperature is measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain output)

require pullup resistors as part of the communication bus. A 0.1-µF power-supply decoupling capacitor is

recommended for local bypassing. Figure 18 shows the typical configuration for the TMP451-Q1 device.

8.2 Typical Application

(1) Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance

cancellation.

Figure 6, Remote Temperature Error vs Differential Capacitance.

Figure 18. TMP451-Q1 Basic Connections Using a Discrete Remote Transistor

22

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