ICS84330CVI REVISION A JANUARY 7, 2011

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©2011 Integrated Device Technology, Inc.

ICS84330CI Data Sheet

720MHZ, CRYSTAL-TO-LVPECL FREQUENCY SYNTHESIZER

Power Considerations

This section provides information on power dissipation and junction temperature for the ICS84330CI.

Equations and example calculations are also provided.

1.

Power Dissipation.

The total power dissipation for the ICS84330CI is the sum of the core power plus the power dissipated in the load(s).

NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.

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2. Junction Temperature.

Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The

maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond

wire and bond pad temperature remains below 125°C.

The equation for Tj is as follows: Tj =



Tj = Junction Temperature



Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)

In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance



flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 31.1°C/W per Table 8A below.

Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:

85°C + 0.89W * 31.1°C/W = 112.7°C. This is below the limit of 125°C.

This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of

board (multi-layer).



Linear Feet per Minute

0

200

500

Multi-Layer PCB, JEDEC Standard Test Boards

37.8°C/W

31.1°C/W

28.3°C/W



Linear Feet per Minute

0200

500

Single-Layer PCB, JEDEC Standard Test Boards

67.8°C/W

55.9°C/W

50.1°C/W

Multi-Layer PCB, JEDEC Standard Test Boards

47.9°C/W

42.1°C/W

39.4°C/W

NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.