CYStech Electronics Corp.

Spec. No. : C326S2-C

Issued Date : 2009.02.16

Revised Date :2015.06.04

Page No. : 6/6

ZD5221AS2 series

CYStek Product Specification

SOD-323 Dimension

*: Typical

DIM

Inches

Millimeters

DIM

Inches

Millimeters

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Max.

A

0.0630

0.0709

1.60

1.80

E

0.0060

-

0.15

-

B

0.0453

0.0531

1.15

1.35

H

0.0000

0.0040

0.00

0.10

C

0.0315

0.0394

0.80

1.00

J

0.0035

0.0070

0.089

0.177

D

0.0098

0.0157

0.25

0.40

K

0.0906

0.1063

2.30

2.70

2.Lead thickness specified per L/F drawing with solder plating.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

 Lead: Pure tin plated.

 Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

 CYStek reserves the right to make changes to its products without notice.

 CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

 CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

D

A

H

J

K

C

E

B

1

2

Style: Pin 1.Cathode 2.Anode

2-Lead SOD-323 Plastic

Surface Mounted Package

CYStek Package Code: S2

Marking:

5 H

XX