Rev. 7

Safety Certified Multilayer

Ceramic Chip Capacitor

RoHS

MERITEK

(X1/Y2, X2/Y3)

15sec.

for user : The peak temperature must not exceed

260ºC. The time above 255ºC must not exceed 15

seconds.

Cooling

After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is recommended to minimize

stress in the solder joint. A cooling rate not exceeding 4ºC per second should be used when forced cooling is necessary.

Cleaning

All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate contamination that could

cause electrolytic surface corrosion. Good results can be obtained by using ultrasonic cleaning of the solvent. The choice of the proper

system is depends upon many factors such as component mix, flux, and solder paste and assembly method. The ability of the cleaning

system to remove flux residues and contamination from under the chips is very important.

Chip Size

ΔT

1808, 1812,

2211, 2220

50ºC

Soldering

Solder

Soldering

Reflow

235

– 260ºC

< 15 sec.

ΔT