LP3983H datasheet(8/10 Pages) POWER

tên linh kiện	LP3983H

Giải thích chi tiết về linh kiện	Ultra-Low-Noise for RF Application

PDF	10 Pages

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nhà sản xuất	POWER [Lowpower Semiconductor inc]

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8 / 10 page

Preliminary Datasheet

LP3983H

LP3983H–00 Version 1.0 Aug.-2014

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Page 8 of 10

surroundings airflow and temperature difference between

junction to ambient.

The maximum power dissipation can be calculated by

following formula:

PD(MAX) = ( TJ(MAX) − TA ) /θJA

Where

TJ(MAX) is the maximum operation junction temperature

125°C, TA is the ambient temperature and the θJA is the

junction to ambient thermal resistance. For recommended

operating conditions specification of LP3983H, where

TJ(MAX) is the maximum junction temperature of the die

(125°C) and TA is the maximum ambient temperature.

The junction to ambient thermal resistance (θJA is layout

dependent) for SOT23-5 package is 250°C/W.

PD(MAX) = (125°C−25°C) / 250 = 400mW (SOT23-5)

The maximum power dissipation depends on operating

ambient temperature for fixed TJ(MAX) and thermal

resistance θJA.

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