IRF8301MPBF datasheet(3/10 Pages) IRF

3 / 10 page

IRF8301MTRPbF

September 6, 2013

Absolute Maximum Ratings

Parameter

Units

PD @TA = 25°C

Power Dissipation

PD @TA = 70°C

Power Dissipation

PD @TC = 25°C

Power Dissipation

Peak Soldering Temperature

°C

Operating Junction and

TSTG

Storage Temperature Range

Thermal Resistance

Parameter

Typ.

Max.

Units

RθJA

Junction-to-Ambient

–––

RθJA

Junction-to-Ambient

12.5

–––

RθJA

Junction-to-Ambient

–––

°C/W

RθJC

Junction-to-Case

–––

1.4

RθJ-PCB

Junction-to-PCB Mounted

1.0

–––

Linear Derating Factor

eÃ

W/°C

0.022

270

-40 to + 150

Max.

2.8

1.8

Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient

1E-006

1E-005

0.0001

0.001

0.01

0.1

100

1000

t1 , Rectangular Pulse Duration (sec)

0.001

0.01

0.1

100

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthja + Tc

Fig 4. Maximum Effective Transient Thermal Impedance, Junction-to-Case

1E-006

1E-005

0.0001

0.001

0.01

0.1

t1 , Rectangular Pulse Duration (sec)

0.001

0.01

0.1

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthjc + Tc

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