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DS121011

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

SGA5263Z

SOT-363 PCB Pad Layout

Package Drawing

Dimensions in inches (millimeters)

Refer to drawing posted at www.rfmd.com for tolerances.

Pin Names and Descriptions

Pin

Name

Description

1, 2,

4, 5

GND

Connection to ground. For best performance use via holes as close to ground leads as possible to reduce lead induc-

tance.

3RF IN

RF input pin. This pin requires the use of an external DC blocking capacitor chosen for the frequency of operation.

6RF OUT

RF output and bias pin. Bias should be supplied to this pin through an external series resistor and RF choke inductor.

Because DC biasing is present on this pin, a DC-blocking capacitor should be used in most applications. (See application

schematic.) The supply side of this bias network should be well bypassed.

Dimensions in inches [millimeters]

RF

OUT

RF

I N

Notes:

1. Provide a large ground pad area under device

pins 1, 2, 4, & 5 with many plated via holes as

shown.

2. Dimensions given for 50 Ohm RF I/O lines are for

31 mil thick Getek. Scale accordingly for different

board thicknesses and dielectric contants.

3. We recommend 1 or 2 ounce copper. Measure-

ments for this data sheet were made on a 31 mil

thick Getek with 1 ounce copper on both sides.