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RVA2007L

DS130725

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

Evaluation Board Bill of Materials (BOM)

Pin Table and Description

Description

Reference

Designator

Manufacturer

Manufacturer’s P/N

EVALUATION BOARD

DDI

RFVAx007L410(A)

CAP, 1

F, 10%, 10V, X5R, 0402

C7, C9- C10

MURATA ELECTRONICS

GRM155R61A105KE15D

RES, 0

0402

R1

KAMAYA, INC

RMC1/16SJPTH

CONN, SMA, END LAUNCH, UNIV, HYB MNT, FLT

J1-J2

HEILIND ELECTRONICS

PER MAT-21-1038

CONN, HDR, ST, PLRZD, 4-PIN, 0.100”

P2

ITW PANCON

MPSS100-4-C

CONN, HDR, ST, PLRZD, 2-PIN, 0.100”

P1

ITW PANCON

MPSS100-2-C

DNP

C1, C3- C4, C6, C11-C12,

R3-R5

RVA2007L MODULE

U1

RFMD

RVA2007L

Pin

Function

Description

1

RFIN

RF input pin. Internal DC block.

2

GND

Ground pin.

3

VPC

desired on application board for control line noise.

4NC

No connection.

5VCC

Power supply for the module. Recommending 1uF decoupling cap on the application board.

6

GND

Ground pin.

7

RFOUT

RF output pin. Internal DC block.

8

VCTRL

Gain control voltage; 0V to 3.3V range. Maximum gain at 0V. Recommending 0.1uF decoupling on the applica-

tion board.

Center

Pad

GND

Center ground pads need to have a good thermal path on the application board. Use solder stencil pattern

shown in the document to define solder paste during assembly.