Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.

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Thermoelectric Cooler Overview

Thermoelectric Cooling Solutions

Cold side Ceramics

(top side)

Al2O3 Ceramics by default

(AlN solution is available by

request)

TE Cooler Lead Free

Internal Assembly

(Lead-Free Solder 230,

Sn-Sb)

Pellets (BiTe posts)

Hot Side Ceramics

(bottom side)

Terminal Wires

Application Tips

1. Never heat TE module more than 200˚C (TEC

assembled at 230˚C).

2. Never use TE module without an attached heat sink

at hot (bottom) side.

1. Connect TE module to DC power supply according

to polarity.

2. Do not apply DC current higher than Imax.

Installation

1. Mechanical Mounting. TEC is placed between two heat exchangers . This construction is fixed by screws or in

another mechanical way. It is suitable for large modules (with dimensions 30x30mm and larger). Miniature types

require other assembling methods in most cases.

1. Soldering. This method is suitable for a TE module with metallized outside surfaces. RMT provides this option

and also makes pre-tinning for TE modules.

2. Glueing. It is an up-to-date method that is used by many customers due to availability of glues with good

thermoconductive properties. A glue is usually based on some epoxy compound filled with some

thermoconductive material such as graphite or diamond powders, silver, SiN and others. The application of a

specific type depends on application features and the type of a TE module.

1

2

3

Object being cooled

Object being cooled

Heatsink

Heatsink

TEC

TEC

Soldering

Gluing

Screw mounting

+

-

TEC Polarity

(can be modified by

request)

Middle Ceramics