RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS140331

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

7 of 7

RFPA5201E

Pin Names and Descriptions

Pin

Name

Description

1

VCC

This pin is connected internally to the collectors of RF device. To achieve specified performance, the layout of

the pin should match the Recommended Land Pattern.

2

PA_EN

High Impedance enable pin, Apply < 0.6VDC to power down the PA. Apply 1.75VDC to 5VDC to enable the

PA.

3

GND

Ground connection.

4

RF_IN

RF input, is internally matched to 50

Ω. DC Blocked

5

GND

Ground connection.

6

PA_EN

High Impedance enable pin, Apply < 0.6VDC to power down the PA. Apply 1.75VDC to 5VDC to enable the

PA.

7

VREG

PA bias voltage. This pin requires regulated supply for best performance.

8

PDET

Power detector provides an output voltage proportional to the RF output power level.

9

VCC3

This pin is connected internally to the collectors of RF device. To achieve specified performance, the layout of

the pin should match the Recommended Land Pattern

10

GND

Ground connection.

11

RFOUT

RF output. Internally matched to 50

Ω and DC Blocked

12

GND

Ground connection.

13

GND

Ground connection.

14

VCC3

This pin is connected internally to the collectors of RF device. To achieve specified performance, the layout of

the pin should match the Recommended Land Pattern

Pkg Base

GND

Ground connection. The back side of the package should be connected to the ground plane through as short

connection as possible, e.g., PCB vias under the device are recommended.