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SMAL850 bảng dữ liệu(PDF) 2 Page - Roithner LaserTechnik GmbH |
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SMAL850 bảng dữ liệu(HTML) 2 Page - Roithner LaserTechnik GmbH |
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2 / 3 page ![]() 15.02.2012 SMAL850 2 of 3 • The LEDs can be soldered in place using the reflow soldering method. We cannot guarantee on the LEDs after they have been assembled using the dip soldering method. • DO NOT apply any stress to the LED particularly when heat. • After soldering the LEDs should be protected from mechanical shock or vibration until the LEDs return to room temperature. • Repairing should not be done after the LEDs have been soldered. • Reflow soldering should not be done more than two times. Temperature Profile PCB Footprint Layout (Unit: mm) Note • The LEDs emit very strong radiation. Do not view directly into the emitting area of the LED during operation! • The powered LEDs generate heat. Heat dissipation should be considered in the application design to avoid the environmental conditions for operation in excess of the absolute maximum ratings. This high power LED must be cooled! Soldering Conditions |
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