TS2938CS33RLG datasheet(2/7 Pages) TSC

2 / 7 page

TS2938

Taiwan Semiconductor

Document Number: DS_P0000209

Version: G15

ABSOLUTE MAXIMUM RATINGS

(Note 1)

PARAMETER

SYMBOL

LIMIT

UNIT

Input Supply Voltage

(Note 2)

VIN

-18 ~ +60

Operation Input Supply Voltage

VOPR

Power Dissipation

(Note 3)

Internally Limited

Operating Junction Temperature Range

-40 ~ +125

Storage Temperature Range

TSTG

-65 ~ +150

THERMAL PERFORMANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Junction to Case Thermal Resistance

RӨJC

°C/W

Notes: RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistances. The case thermal reference is defined

at the solder mounting surface of the drain pins. RӨJA is guaranteed by design while RӨCA is determined by the user’s board

design. RӨJA shown below for single device operation on FR-4 PCB in still air.

ELECTRICAL SPECIFICATIONS

(VIN=VOUT+1V, IL=5mA, CO=10µF, TA=25

oC, unless otherwise noted)

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNIT

Output Voltage

TA=25

3.23

3.3

3.36

4.9

5.1

TA=25~85

3.17

3.3

3.43

4.8

5.2

Output Voltage Temperature Coefficient

150

ppm/

Line Regulation

Vo+1V

≤ V

≤ 26V

0.05

0.5

Load Regulation

5mA

≤ I

≤ 500mA

0.2

1.0

Dropout Voltage

(Note 4)

IL=100mA

100

200

IL=300mA

300

400

IL=500mA

500

600

Quiescent Current

(Note 5)

IL=100µA

200

300

µA

IL=300mA

IL=500mA

Short Circuit Current

(Note 6)

VOUT =0

0.9

1.3

Output Noise,

10Hz to 100KHz, IL=10mA

CL=2.2µF

500

µVrms

CL=3.3µF

350

CL=33µF

120

Ripple Rejection

Ratio

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