V3PAL45 datasheet(3/6 Pages) VISHAY

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V3PAL45

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Vishay General Semiconductor

Revision: 30-Jul-13

Document Number: 87906

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Fig. 3 - Typical Instantaneous Forward Characteristics

Fig. 4 - Typcial Reverse Leakage Characteristics

Fig. 5 - Typical Junction Capacitance

Fig. 6 - Typcial Transient Thermal Impedance

Fig. 7 - Thermal Resistance Junction to Ambient vs.

Copper Pad Areas

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

Instantaneous Forward Voltage (V)

A = 150 °C

A = 25 °C

A = 100

A = 125 °C

0.001

0.01

0.1

100

Percent of Rated Peak Reverse Voltage (%)

A = 100 °C

A = 150 °C

A = 125 °C

A = 25 °C

0.1

100

1000

100

Reverse Voltage (V)

TJ = 25 °C

f = 1.0 MHz

Vsig = 50 mVp-p

0.01

0.1

100

1000

100

t - Pulse Duration (s)

Junction to Ambient

100

110

Copper Pad Areas (cm2)

S (cm

Epoxy printed circiut

board FR4 copper

thickness = 70 μm

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