LT1812 datasheet(5/12 Pages) LINER

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LT1812

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Minimum Supply Voltage

±2V

PSRR

Power Supply Rejection Ratio

VS = ±2V to ±5.5V

AVOL

Large-Signal Voltage Gain

VOUT = ±3V, RL = 500Ω

0.8

V/mV

VOUT = ±3V, RL = 100Ω

0.6

V/mV

VOUT

Maximum Output Swing

RL = 500Ω, 30mV Overdrive

±3.60

RL = 100Ω, 30mV Overdrive

±3.15

IOUT

Maximum Output Current

VOUT = ±3V, 30mV Overdrive

±30

ISC

Output Short-Circuit Current

VOUT = 0V, 1V Overdrive (Note 3)

±55

Slew Rate

AV = – 1 (Note 5)

350

µs

GBW

Gain Bandwidth Product

f = 200kHz

MHz

ISHDN

SHDN Pin Current

SHDN > V – + 2.0V (On)

±2

µA

SHDN < V – + 0.4V (Off)

– 200

µA

Supply Current

SHDN > V – + 2.0V (On)

SHDN < V – + 0.4V (Off)

200

µA

ELECTRICAL CHARACTERISTICS

Note 1: Absolute Maximum Ratings are those values beyond which the life of

the device may be impaired.

Note 2: Differential inputs of

±3V are appropriate for transient operation only,

such as during slewing. Large sustained differential inputs can cause

excessive power dissipation and may damage the part.

Note 3: A heat sink may be required to keep the junction temperature below

absolute maximum when the output is shorted indefinitely.

Note 4: Input offset voltage is pulse tested and is exclusive of warm-up drift.

Note 5: Slew rate is measured between

±2V on the output with ±3V input for

±5V supplies and 2VP-P on the output with a 3VP-P input for single 5V

supplies.

Note 6: Full power bandwidth is calculated from the slew rate:

FPBW = SR/2

πVP.

Note 7: This parameter is not 100% tested.

Note 8: The LT1812C is guaranteed to meet specified performance from

°C to 70°C. The LT1812C is designed, characterized and expected to meet

specified performance from – 40

°C to 85°C but is not tested or QA sampled

at these temperatures. The LT1812I is guaranteed to meet specified

performance from –40

°C to 85°C.

Note 9:

θJA is specified for a 2500mm2 board covered with 2 oz copper on

both sides. Thermal resistance varies, depending upon the amount of PC

board metal attached to the device. For this package in particular, power is

dissipated primarily through Pin 4, which should therefore, have a good

thermal connection to a copper plane.

–40

°C ≤ TA ≤ 85°C. VS = ±5V, VCM = 0V unless otherwise noted (Note 8).

–40

°C ≤ TA ≤ 85°C, VS = 5V, VCM = 2.5V, RL to 2.5V unless otherwise noted (Note 8).

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

VOS

Input Offset Voltage

(Note 4)

3.5

∆VOS/∆T

Input Offset Voltage Drift

(Note 7)

µV/°C

IOS

Input Offset Current

600

Input Bias Current

±6

µA

VCM

Input Voltage Range (Positive)

3.5

Input Voltage Range (Negative)

1.5

CMRR

Common Mode Rejection Ratio

VCM = 1.5V to 3.5V

AVOL

Large-Signal Voltage Gain

VOUT = 1.5V to 3.5V, RL = 500Ω

0.6

V/mV

VOUT = 2.0V to 3.0V, RL = 100Ω

0.4

V/mV

VOUT

Maximum Output Swing (Positive)

RL = 500Ω, 30mV Overdrive

3.7

RL = 100Ω, 30mV Overdrive

3.5

Maximum Output Swing (Negative)

RL = 500Ω, 30mV Overdrive

1.3

RL = 100Ω, 30mV Overdrive

1.5

IOUT

Maximum Output Current

VOUT = 3.5V or 1.5V, 30mV Overdrive

±17

ISC

Output Short-Circuit Current

VOUT = 2.5V, 1V Overdrive (Note 3)

±40

Slew Rate

AV = – 1 (Note 5)

125

µs

GBW

Gain Bandwidth Product

f = 200kHz

MHz

ISHDN

SHDN Pin Current

SHDN > V – + 2.0V (On)

±2

µA

SHDN < V – + 0.4V (Off)

– 100

µA

Supply Current

SHDN > V – + 2.0V (On)

SHDN < V – + 0.4V (Off)

100

µA

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