Data Sheet S16411EJ1V0DS

19

µµµµ PD16707

7. RECOMMENDED MOUNTING CONDITIONS

The

µ PD16707 should be soldered and mounted under the following recommended conditions.

For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact an NEC sales representative.

Recommended Soldering Conditions for Surface Mounting Soldering Conditions.

µµµµ PD16707N-xxx: TCP (TAB Package)

Mounting Condition

Mounting Method

Condition

Thermocompression

Soldering

Heating tool 300 to 350

°C, heating for 2 to 3 seconds : pressure 100g

(per solder)

ACF

(Adhesive

Conductive Film)

Temporary bonding 70 to 100

Real bonding 165 to 180

(When using the anisotropy conductive film SUMIZAC1003 of

Sumitomo Bakelite,Ltd).

Caution

To find out the detailed conditions for mounting the ACF part, please contact the ACF

manufacturing company. Be sure to avoid using two or more mounting methods at a time.