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AN3169 bảng dữ liệu(PDF) 2 Page - STMicroelectronics |
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AN3169 bảng dữ liệu(HTML) 2 Page - STMicroelectronics |
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2 / 12 page ![]() Triac technologies and immunity AN3169 2/12 Doc ID 17194 Rev 1 1 Triac technologies and immunity 1.1 Triac silicon structures Triac devices are by far the most used silicon devices to drive AC loads directly connected on the mains voltage. Triacs are widely used because they present three major advantages: ● Low forward voltage drop ● Turn on by gate current pulse ● High voltage immunity The first two advantages come from the active silicon structure of the Triac which is based on four alternatively doped silicon layers (N-P-N-P). These four layers implement two bipolar transistors which are coupled to maintain the on state even if the gate current is removed (see Figure 1). Figure 1. Active simplified structure of a Triac The third advantage comes from the fact that the voltage is withstood by the silicon thickness. It's then quite easy to reach breakdown levels above 1 kV. The main issue is then the junction termination. Several low cost technologies are used since the 70’s which used a glass passivation. For example the “Mesa” technology (see Figure 2) uses glass on both sides of the die (see References 1, 2, and 3) to passivate both junctions, which hold both forward and reverse high voltages (referred to as “Cathode” or “A1” or “COM” polarity). The “Top” glass technology (see References 1, 2, and 3) uses only one glass layer (see Figure 3). This avoids having some glass at the bottom of the die, and so it is easier to put such dies in every kind of package. Figure 2. “Mesa” glass technology N3 P2 N2 P1 N1 P2 N2 P1 N4 A2 A1 G N3 P2 N2 P1 N1 P2 N2 P1 N4 Metalization N N N P P N N Anode Glass Cathode Gate |
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