DocID14016 Rev 4

9/15

AN2639

Soldering

Refer to Figure 3 for the recommended reflow soldering profiles.

STMicroelectronics Lead-free packages are warranted for such reflow profile conditions.

Figure 3. Recommended reflow soldering profile

1. All temperatures refer to topside of the package, measured on the body surface.

Profile feature

Lead-free assembly

3 °C/second max.

Preheat

150 °C

200 °C

60-120 seconds

Time maintained above:

217°C

60-150 seconds

Package dependant, see temperature indicated

on box label.

Ramp-down rate

6°C/second max.

Time 25 °C to peak temperature

8 minutes max.