UPD62 datasheet(57/64 Pages) NEC

57 / 64 page

µPD62

Data Sheet U14208EJ1V0DS00

15. RECOMMENDED SOLDERING CONDITIONS

Carry out the soldered packaging of this product under the following recommended conditions.

For details of the soldering conditions, refer to information material Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than the recommended conditions, please consult one of our NEC

sales representatives.

Table 15-1. Soldering Conditions for Surface-Mount Type

µPD62MC-×××-5A4: 20-pin plastic SSOP (300 mil)

Soldering Method

Soldering Condition

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235

°C; time: within 30 secs. max. (210 °C or higher);

IR35-00-3

count: no more than three times

VPS

Package peak temperature: 215

°C; time: 40 secs. max. (200 °C or higher); count:

VP15-00-3

no more than three times

Wave soldering

Solder bath temperature: 260

°C max.; time: 10 secs. max.; count: once;

WS60-00-1

Preliminary heat temperature: 120

°C max. (Package surface temperature)

Partial heating

Pin temperature: 300

°C or less ; time: 3 secs or less (for each side of the device)

—

Caution Using more than one soldering method should be avoided (except in the case of partial

heating).

UPD62 bảng dữ liệu(PDF) 57 Page - NEC