AN4213 datasheet(34/42 Pages) STMICROELECTRONICS

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Experimental results

AN4213

34/42

DocID023984 Rev 2

Experimental results

The experimental results have been measured with different input voltages and leaving the

board exposed to room temperature (25 °C). The devices have been kept soldered on the

PCB. Temperature has been detected using an infrared thermal camera pointed on the

package of the devices. The test equipment used is provided below as well as the test

conditions:

•

Input voltage: 185 V

- 230 V

- 265 V

•

Test equipment:

–

Agilent AC power source/analyzer 6813B

–

Flir system thermal camera

–

LeCroy 64Xi-A oscilloscope

–

LeCroy active current probe CP030

–

LeCroy active differential voltage probe ADP305

•

Ambient temperature: 25°C.

The table below shows electrical and thermal results obtained with both packages, DPAK

and PowerFLAT™ 5x6, at different input voltages.

Changing input voltage, the main electrical parameters of the PFC and THD suggest that

the application performances are very good. The temperatures of the two packages are not

so different and the devices work within safety conditions.

Table 3. Main electrical and thermal results @ 25 °C ambient temperature

Device

VIN(V)

lin(A)

Power

factor

THD (%)

Pin (W)

THB (°C)

TPFC

(°C)

STD13N60M2

(DPAK)

185

0.576

0.997

∼

7.5

106

64.2

STL13N60M2

(PowerFLAT™ 5x6)

0.569

0.997

∼

7.2

104.9

71.9

STD13N60M2

(DPAK)

230

0.465

0.995

∼

8.1

106.4

66.5

STL13N60M2

(PowerFLAT™ 5x6)

0.456

0.994

∼

104.4

STD13N60M2

(DPAK)

265

0.404

0.991

∼

106.3

71.8

70.4

STL13N60M2

(PowerFLAT™ 5x6)

0.395

0.99

∼

8.5

103.9

72.2

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