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AN2994 bảng dữ liệu(PDF) 29 Page - STMicroelectronics |
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AN2994 bảng dữ liệu(HTML) 29 Page - STMicroelectronics |
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29 / 38 page ![]() AN2994 Thermal measures Doc ID 15796 Rev 2 29/38 5 Thermal measures To verify the reliability of the design, a thermal mapping by means of an IR camera has been done. Figure 38 and Figure 39 show the thermal measurements on the board component side at nominal input voltages and full load. Pointers (visible on the images) placed across the key components show the relevant temperature. Table 1 provides the correlation between the measured points and the components, for both thermal maps. The ambient temperature during both measurements was 27°C. According to the results obtained, all the board components are operating within their temperature limits. Figure 38. Thermal map at 115 Vac, 60 Hz - full load Figure 39. Thermal map at 230 Vac, 50 Hz - full load Table 1. Measured temperature at 115 Vac and 230 Vac - full load Point Component Temperature at 115 Vac Temperature at 230 Vac A D2 57.3 °C 42.3 °C B Q2 62.2 °C 48.6 °C C Q1 62.4 °C 48.3 °C D D3 60.2 °C 47.8 °C E C7 38.2 °C 35.4 °C F L1 53.4 °C 37.2 °C G L3 55.1 °C 40.1 °C H L4 – CORE 61.8 °C 49.3 °C I L4 – WINDING 68.7 °C 52.8 °C |
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