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IRF7350 bảng dữ liệu(PDF) 1 Page - International Rectifier |
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IRF7350 bảng dữ liệu(HTML) 1 Page - International Rectifier |
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1 / 16 page ![]() HEXFET® Power MOSFET Description 08/09/01 www.irf.com 1 IRF7350 SO-8 Symbol Parameter Typ. Max. Units RθJL Junction-to-Drain Lead ––– 20 RθJA Junction-to-Ambient ––– 62.5 °C/W Thermal Resistance N-Ch P-Ch VDSS 100V -100V RDS(on) 0.21Ω 0.48 Ω D1 N- CHA NNE L M O S FE T P -CHA NNE L M O S F E T D1 D2 D2 G1 S2 G2 S1 T op V iew 8 1 2 3 4 5 6 7 These dual N and P channel HEXFET® power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET® power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in DC motor drives and load management applications. The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. l Ultra Low On-Resistance l Dual N and P Channel MOSFET l Surface Mount l Available in Tape and Reel Parameter Units A Absolute Maximum Ratings Max. N-Channel P-Channel VDS Drain-to-Source Voltage 100 -100 ID @ TA = 25°C Continuous Drain Current, VGS @ 10V 2.1 -1.5 ID @ TA = 70°C Continuous Drain Current, VGS @ 10V 1.7 -1.2 IDM Pulsed Drain Current 8.4 -6.0 PD @TA = 25°C Power Dissipation 2.0 W Linear Derating Factor 0.016 W/°C EAS Single Pulse Avalanche Energy 35 51 mJ VGS Gate-to-Source Voltage ± 20 ± 20 V dv/dt Peak Diode Recovery dv/dt 4.0 4.3 V/ns TJ, TSTG Junction and Storage Temperature Range -55 to + 150 °C PD - 94226B |
Số phần tương tự - IRF7350 |
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Mô tả tương tự - IRF7350 |
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