SD300N/R Series

3

www.irf.com

Bulletin I2081 rev. C 03/03

SD300N/R

16 to 20

25 to 32

T

J

Max. junction operating temperature range

-40 to 180

-40 to 150

T

stg

Max. storage temperature range

-55 to 200

-55 to 200

R

thJC

Max. thermal resistance, junction to case

0.11

DC operation

R

thCS

Max. thermal resistance, case

Mounting surface, smooth, flat and

to heatsink

greased

T

Max. allowed mounting torque ±10%

27

Nm

Not lubricated threads

wt

Approximate weight

250

g

Case style

DO-205AB (DO-9)

See Outline Table

°C

K/W

0.04

Thermal and Mechanical Specifications

Parameter

Units

Conditions

16 to 20

25 to 32

16 to 20

25 to 32

180°

0.019

0.019

0.013

0.013

120°

0.023

0.023

0.023

0.023

90°

0.028

0.028

0.030

0.030

K/W

T

J

= T

J

max.

60°

0.042

0.042

0.044

0.044

30°

0.073

0.073

0.074

0.074

Sinusoidal conduction Rectangular conduction

Conduction angle

Units

Conditions

Ordering Information Table

1

23

6

Device Code

SD

30

0

N

32

P

C

4

5

7

1

-

Diode

2

-

Essential part number

3

-

0 = Standard recovery

4

-

N = Stud Normal Polarity (Cathode to Stud)

R = Stud Reverse Polarity (Anode to Stud)

5

-

Voltage code: Code x 100 = V

RRM

(See Voltage Ratings table)

6

-

P = Stud base DO-205AB (DO-9) 3/4" 16UNF-2A

7

-

C = Ceramic Housing

NOTE: For metric Device M16 x 1.5 Contact Factory

∆R

thJC

Conduction

(The following table shows the increment of thermal resistence R

thJC

when devices operate at different conduction angles than DC)