Conclusion

AN2348

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Doc ID 12282 Rev 5

8

Conclusion

Lead-free Flip-Chip packages have been developed by STMicroelectronics for electronic

applications where integration and performance are the main concerns of designers.

STMicroelectronics Flip Chips offer:

●

Remarkable board space saving (package size equal to die size and total height less

than 605 µm)

●

Enhanced electrical performance (minimized parasitic inductance due to very short

electrical paths and absence of redistribution layer)

●

High reliability due to integration of a whole function traditionally based on discrete

interconnected components.

Flip Chips are delivered in tape and reel and are fully compatible with other high volume

SMD components (standard plastic packages or CSP/BGA packages) regarding existing

pick and place equipment, standard solder reflow assembly equipment and standard PCB

techniques.

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Revision history

Table 6.

Document revision history

Date

Revision

Changes

15-Sep-2006

1

First issue

15-Oct-2006

2

Added section 5.4.1 on Rework procedure.

10-Mar-2010

3

Updated bump composition in Section 1: Product description and

Section 2: Mechanical description. Updated solder paste

composition in Section 5.3: PCB assembly guidelines. Updated

for 2-bar Flip Chips.

06-Sep-2011

4

Updated references to standards. Added parameter variations for

tape dimensions in Figure 4 and Figure 5.

Added Figure 7. Updated reel label in Figure 9. Updated soldering

reflow profile in Figure 12.

19-Oct-2012

5

Corrected typographical error in Figure 12. Restructured Table 5.