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Data Sheet S13447EJ1V0DS00

RECOMMENDED SOLDERING CONDITIONS

µPD16856 should be soldered and mounted under the following recommended conditions. For soldering methods

and conditions other than those recommended below, contact your NEC sales representative.

• For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235

°C, Time: 30 sec. Max. (at 210°C or higher),

Count: three times or less, Exposure limit: none

with little chlorine content (chlorine: 0.2 Wt

% Max.) is recommended

IR35-00-3

VPS

Package peak temperature: 215

°C, Time: 40 sec. Max. (at 200°C or higher),

Count: three times or less, Exposure limit: none

with little chlorine content (chlorine: 0.2 Wt

% Max.) is recommended

VP15-00-3

Wave soldering

Package peak temperature: 260

°C, Time: 10 sec. Max., Proheating

temperature: 120

°C Max., Count: once, Flux: Rosin-based flux with little

chlorine content (chlorine: 0.2 Wt

% Max.) is recommended

WS60-00-1

Note After opening the dry pack, store it at 25

°C or less and 65% RH or less for the allowable storage period.

Caution

Do not use different soldering methods together.