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IRFP150 bảng dữ liệu(PDF) 1 Page - International Rectifier |
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IRFP150 bảng dữ liệu(HTML) 1 Page - International Rectifier |
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1 / 8 page ![]() IRFP150N HEXFET® Power MOSFET Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The TO-247 package is preferred for commercial- industrial applications where higher power levels preclude the use of TO-220 devices. The TO-247 is similar but superior to the earlier TO-218 package because of its isolated mounting hole. S D G VDSS = 100V RDS(on) = 0.036W ID = 42A l Advanced Process Technology l Dynamic dv/dt Rating l 175°C Operating Temperature l Fast Switching l Fully Avalanche Rated Description TO-247AC www.irf.com 1 PD- 91503C Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 42 ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 30 A IDM Pulsed Drain Current
140 PD @TC = 25°C Power Dissipation 160 W Linear Derating Factor 1.1 W/°C VGS Gate-to-Source Voltage ± 20 V EAS Single Pulse Avalanche Energy
420 mJ IAR Avalanche Current
22 A EAR Repetitive Avalanche Energy 16 mJ dv/dt Peak Diode Recovery dv/dt
5.0 V/ns TJ Operating Junction and -55 to + 175 TSTG Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case ) °C Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m) Absolute Maximum Ratings Parameter Typ. Max. Units RqJC Junction-to-Case ––– 0.95 RqCS Case-to-Sink, Flat, Greased Surface 0.24 ––– °C/W RqJA Junction-to-Ambient ––– 40 Thermal Resistance |
Số phần tương tự - IRFP150 |
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Mô tả tương tự - IRFP150 |
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