Thermal Resistance

Parameter

Min. Typ. Max. Units

Test Conditions

RthJC

Junction-to-Case

—

—

0.83

RthJPCB

Junction-to-PC Board

—

TBD

—

K/W

Soldered to a copper clad PC board

Source-Drain Diode Ratings and Characteristics

Parameter

Min. Typ. Max. Units

Test Conditions

IS

Continuous Source Current (Body Diode)

—

—

5.5

Modified MOSFET symbol showing the

ISM

Pulse Source Current (Body Diode) Œ

——

22

integral reverse p-n junction rectifier.

VSD

Diode Forward Voltage

—

—

1.8

V

trr

Reverse Recovery Time

—

—

1200

ns

Tj = 25°C, IF = 5.5A, di/dt ≤ 100A/µs

QRR

Reverse Recovery Charge

—

—

8.4

µCVDD ≤ 50V 

ton

Forward Turn-On Time

Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.

Parameter

Min.

Typ. Max. Units

Test Conditions

BVDSS

Drain-to-Source Breakdown Voltage

1000

—

—

V

VGS = 0V, ID = 1.0 mA

∆BVDSS/∆TJ Temperature Coefficient of Breakdown

—

1.4

—

V/°C

Reference to 25°C, ID = 1.0 mA

Voltage

RDS(on)

Static Drain-to-Source

—

—

2.0

VGS = 10V, ID = 3.5A

On-State Resistance

—

—

2.25

Ω

VGS = 10V, ID = 5.5A

VGS(th)

Gate Threshold Voltage

2.0

—

4.0

V

VDS = VGS, ID = 250µA

gfs

Forward Transconductance

5.2

—

—

S ( )VDS > 15V, IDS = 3.5A 

IDSS

Zero Gate Voltage Drain Current

—

—

25

VDS = 0.8 x Max Rating,VGS = 0V

—

—

250

VDS = 0.8 x Max Rating

VGS = 0V, TJ = 125°C

IGSS

Gate-to-Source Leakage Forward

—

—

100

VGS = 20V

IGSS

Gate-to-Source Leakage Reverse

—

—

-100

VGS = -20V

Qg

Total Gate Charge

87

—

200

VGS =10V, ID = 5.5A

Qgs

Gate-to-Source Charge

8.7

—

20

VDS = Max. Rating x 0.5

Qgd

Gate-to-Drain (“Miller”) Charge

49

—

110

see figures 6 and 13

td(on)

Turn-On Delay Time

—

—

30

VDD = 500V, ID = 5.5A,

tr

Rise Time

—

—

44

RG = 2.35Ω, VGS = 10V

td(off)

Turn-Off Delay Time

—

—

210

tf

Fall Time

—

—

60

see figure 10

LD

Internal Drain Inductance

—

2.0

—

LS

Internal Source Inductance

—

6.5

—

Ciss

Input Capacitance

—

2400

—

VGS = 0V, VDS = 25V

Coss

Output Capacitance

—

240

—

f = 1.0 MHz

Crss

Reverse Transfer Capacitance

—

80

—

see figure 5

IRFNG50 Device



µA

nC

pF

nH

ns

Measured from the

drain lead, 6mm (0.25

in.) from package to

center of die.

Measured from the

source lead, 6mm

(0.25 in.) from package

to source bonding pad.

Modified MOSFET

symbol showing the

internal inductances.

nA

A

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