Preliminary Data Sheet

19

CAUTIONS ON USE

1.

Observe precautions for handling because this IC is an electrostatic sensitive device.

2.

Form as wide a ground pattern as possible to minimize its impedance.

3.

Keep the track length of the ground pins as short as possible (to prevent malfunction).

4.

Connect a bypass capacitor to the Vcc pin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions.

For soldering methods and conditions other than the recommended conditions, consult an NEC sales

representative.

µµµµPC8139GR-7JH

Soldering Method

Soldering Conditions

Symbol

Infrared reflow

Package peak temperature: 235°C.

Duration: 30 sec. max. (210°C or above)

Number of times: 2, Exposure limit: None

Note

IR35-00-2

VPS

Package peak temperature: 215°C.

Duration: 40 sec. max. (200°C or above)

Number of times: 2, Exposure limit: None

Note

VP15-00-2

Wave soldering

Soldering bath temperature : 260°C max.

Duration: 10 sec. max.

Number of times: 1, Exposure limit: None

Note

WS60-00-1

Partial heating method

Pin temperature: 300°C max.

Duration: 3 sec. max. (per side of device)

Exposure limit: None

Note

Note Storage period (days) after opening the dry pack. Storage conditions: 25°C and 65% RH or less

(This product is not dry packed.)

Caution

Do not use different soldering methods together (except for pin partial heating.)

For details of recommended soldering conditions, refer to the information document Semiconductor Device

Mounting Technology Manual (C10535E)