IR2117 datasheet(2/7 Pages) IRF

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IR2117

B-76 CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL

Parameter

Value

Symbol

Definition

Min.

Max.

Units

High Side Floating Supply Voltage

-0.3

625

High Side Floating Supply Offset Voltage

VB - 25

VB + 0.3

VHO

High Side Floating Output Voltage

VS - 0.3

VB + 0.3

VCC

Logic Supply Voltage

-0.3

VIN

Logic Input Voltage

-0.3

VCC + 0.3

dVs/dt

Allowable Offset Supply Voltage Transient (Figure 2)

—

V/ns

Package Power Dissipation @ TA ≤ +25°C

(8 Lead DIP)

—

1.0

(8 Lead SOIC)

—

0.625

RθJA

Thermal Resistance, Junction to Ambient

(8 Lead DIP)

—

125

(8 Lead SOIC)

—

200

Junction Temperature

—

150

Storage Temperature

-55

150

°C

Lead Temperature (Soldering, 10 seconds)

—

300

Absolute Maximum Ratings

Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-

eters are absolute voltages referenced to COM. The Thermal Resistance and Power Dissipation ratings are measured

under board mounted and still air conditions. Additional information is shown in Figures 5 through 8.

Parameter

Value

Symbol

Definition

Min.

Max.

Units

High Side Floating Supply Absolute Voltage

VS + 10

VS + 20

High Side Floating Supply Offset Voltage

Note 1

600

VHO

High Side Floating Output Voltage

VCC

Logic Supply Voltage

VIN

Logic Input Voltage

VCC

Ambient Temperature

-40

125

°C

Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS.

Recommended Operating Conditions

The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the

recommended conditions. The VS offset rating is tested with all supplies biased at 15V differential.

°C/W

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