µPC7900A Series

9

RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below. If other

soldering processes are used, or if the soldering is performed under different conditions, please make sure to

consult with our sales offices.

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

TYPES OF THROUGH HOLE MOUNT DEVICE

µPC7900AHF Series

Soldering Process

Soldering Conditions

Symbol

Wave soldering

Solder temperature: 260 ˚C or below.

Flow Time: 10 seconds or below.

REFERENCE

Document Name

Document No.

NEC semiconductor device reliability/quality control system.

IEI-1212

Quality grade on NEC semiconductor devices.

C11531E

Semiconductor device mounting technology manual.

C10535E

IC package manual.

C10943X

Guide to quality assurance for semiconductor devices.

MEI-1202

Semiconductors selection guide.

X10679E