ADM4853_15 datasheet(15/16 Pages) AD

15 / 16 page

ADM4850/ADM4851/ADM4852/ADM4853/ADM4854/ADM4855/ADM4856/ADM4857

Rev. D | Page 15 of 16

OUTLINE DIMENSIONS

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AA

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099)

45°

8°

0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2441)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10

Figure 30. 8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-8)

Dimensions shown in millimeters and (inches)

COMPLIANT TO JEDEC STANDARDS MO-187-AA

6°

0°

0.80

0.55

0.40

0.65 BSC

0.40

0.25

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.09

3.20

3.00

2.80

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

Figure 31. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

EXPOSED

PAD

(BOTTOM VIEW)

0.50

BSC

PIN 1

INDICATOR

0.50

0.40

0.30

TOP

VIEW

12° MAX

0.70 MAX

0.65 TYP

0.90 MAX

0.85 NOM

0.05 MAX

0.01 NOM

0.20 REF

1.89

1.74

1.59

1.60

1.45

1.30

3.25

3.00 SQ

2.75

2.95

2.75 SQ

2.55

PIN 1

INDICATOR

SEATING

PLANE

0.30

0.23

0.18

0.60 MAX

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 32. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

3 mm × 3 mm Body, Very Thin, Dual Lead

(CP-8-2)

Dimensions shown in millimeters

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