Data Sheet P12151EJ3V0DS00

19

NOTE ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesires oscillation).

(3) Keep the track length of the ground pins as short as possible.

(5) A matching circuit must be externally attached to output port.

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product.

Please consult with our sales officers in case other soldering process is used or in case soldering is done under

different conditions.

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

µµµµPC3202GR

Soldering Process

Soldering Conditions

Symbol

Infrared ray reflow

Peak package’s surface temperature: 235°C or below,

Reflow time: 30 seconds or below (210°C or higher),

Number of reflow process: 3, Exposure limit

*1

None)

IR35-00-3

VPS

Peak package’s surface temperature: 215°C or below,

Reflow time: 40 seconds or below (200°C or higher),

Number of reflow process: 3, Exposure limit

*1

None)

VP15-00-3

Partial heating method

Terminal temperature: 300°C or below,

Flow time: 3 seconds or below, Exposure limit

*1

Note

*1

Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25 °C and relative humidity at 65 % or less.

Caution

Do not apply more than single process at once, except for “Partial heating method”.