HIP1030AS datasheet(2/5 Pages) INTERSIL

2 / 5 page

Absolute Maximum Ratings

Thermal Information

Maximum Supply Voltage VCC . . . See O.V. Shutdown Limit, VOVSD

Input Voltage, VIN (Note 1) . . . . . . . . . . . . . . . . . -1V to (VCC - 0.5V)

Load Current, IOUT . . . . . . . . . . . . . . . . . . . . . . . . .Internal Limiting

Load Dump (Survival) . . . . . . . . . . . . . . . . . . . . . . . . . .

±60VPEAK

Reverse Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -16V

Operating Conditions

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 125oC

Thermal Resistance (Typical, Note 2)

θJA (oC/W) θJC (oC/W)

Plastic SIP Package . . . . . . . . . . . . . .

Maximum Power Dissipation (Note 3)

At TA = 125

oC, Inﬁnite Heat Sink. . . . . . . . . . . . . . . . . . . . . 6.25W

Maximum Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . . 150

Maximum Storage Temperature Range . . . . . . . . . .-40oC to 150oC

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC

(Lead Tips Only)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation

of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

NOTES:

1. The Input Control Voltage, VIN shall not be greater than (VCC - 0.5V) and shall not exceed +7V when VCC is greater than 7.5V.

θJA is measured with the component mounted on an evaluation PC board in free air.

3. The worst case thermal resistance,

θJC for the SIP TS-001AA 5 lead package is 4oC/W. The calculation for dissipation and junction

temperature rise due to dissipation is:

PD = (VCC-VOUT)(IOUT) + (VCC)(ICCMAX - IOUT) or (VCC)(ICCMAX) - (VOUT)(IOUT)

TJ = TAMBIENT + (PD) (θJC) for an inﬁnite Heat Sink.

Refer to Figure 1 for Derating based on Dissipation and Thermal Resistance. Derating from 150oC is based on the reciprocal of thermal

resistance,

θJC + θHS. For example: Where θJC = 4oC/W and given θHS = 6oC/W as the thermal resistance of an external Heat Sink,

the junction-to-air thermal resistance,

θJA = 10oC/W. Therefore, for the maximum allowed dissipation, derate 0.1W/oC for each degree

from TAMB to the maximum rated junction temperature of 150

oC. If T

AMB = 100

oC, the maximum P

D is (150 - 100) x 0.1W/

oC = 5W.

Electrical Speciﬁcations

TA = -40

oC to 125oC, V

IN = 2V, VCC = +12V, Unless Otherwise Speciﬁed

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Operating Voltage Range

VCC

4.5

Over-Voltage Shutdown

VOVSD

RL = 1KΩ; VIN = 2V

Over-Temperature Limiting

TSD

150

Negative Pulse

Output Clamp Voltage

VCL

ICL = -100mA; VCC = 4.5V to 25V

(VCC - 35) (VCC - 30.5)

(VCC - 28)

Short Circuit Current Limiting

ISC

(Note 4)

1.1

1.6

2.5

Input Control ON

VIH

2.0

Input Control OFF

VIL

0.8

Input Current High

IIH

VIN = 5.5V, VCC = 6V to 24V

µA

Input Current Low

IIL

VIN = 0.8V, VCC = 6V to 24V

µA

Supply Current, Full Load

Input Control ON

ICCMAX

VIN = 2V; IOUT = 1.0A;

1.05

1.1

Supply Current, No Load

Input Control OFF

ICCMIN

VIN = 0V; IOUT = 0A;

100

µA

Input-Output Forward Voltage

Drop (VCC - VOUT)

VSAT

IOUT = 1A; VCC = 4.5V to 25V

0.6

Output Leakage

IOUT_LK

VIN = 0.8V; VCC = 6V to 24V

µA

Turn ON Time

tON

RL = 80Ω; (Note 5)

µs

Turn OFF Time

tOFF

RL = 80Ω; (Note 5)

µs

NOTES:

4. Short circuit current will be reduced when thermal shutdown occurs. Testing of short circuit current may require a short duration pulse.

See Figure 7.

5. Refer to Figures 3A and 3B for typical switching speeds with a 20

Ω Load.

HIP1030

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