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ACS86DMSR bảng dữ liệu(PDF) 6 Page - Intersil Corporation

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nhà sản xuất  INTERSIL [Intersil Corporation]
Trang chủ  http://www.intersil.com/cda/home
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ACS86DMSR bảng dữ liệu(HTML) 6 Page - Intersil Corporation

  ACS86DMSR Datasheet HTML 1Page - Intersil Corporation ACS86DMSR Datasheet HTML 2Page - Intersil Corporation ACS86DMSR Datasheet HTML 3Page - Intersil Corporation ACS86DMSR Datasheet HTML 4Page - Intersil Corporation ACS86DMSR Datasheet HTML 5Page - Intersil Corporation ACS86DMSR Datasheet HTML 6Page - Intersil Corporation  
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All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
ACS86MS
Metallization Mask Layout
ACS86MS
(2)
(1)
(13)
GND
Y3
Y2
Y1 (3)
A2 (4)
NC
B2 (5)
(12) A4
(11) Y4
NC
A1
B4
B1
(6)
(7)
(8)
(10) B3
(14)
VCC
A3
(9)
Spec Number
518849
Die Characteristics
DIE DIMENSIONS:
88 mils x 88 mils
2.24mm x 2.24mm
METALLIZATION:
Type: AlSiCu
Metal 1 Thickness: 6.75k
Å (Min), 8.25kÅ (Max)
Metal 2 Thickness: 9k
Å (Min), 11kÅ (Max)
GLASSIVATION:
Type: SiO2
Thickness: 8k
Å
±1kÅ
DIE ATTACH:
Material: Silver Glass or JM7000 Polymer after 7/1/95
WORST CASE CURRENT DENSITY:
< 2.0 x 105 A/cm2
BOND PAD SIZE:
> 4.3 mils x 4.3 mils
> 110
µm x 110µm



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