87C196 datasheet(21/21 Pages) INTEL

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PRODUCT PREVIEW

AUTOMOTIVE — 87C196LA

6.0 THERMAL CHARACTERISTICS

All thermal impedance data is approximate for static

air conditions at 1 watt of power dissipation. Values

will change depending on operating conditions and

the application. The Intel

Packaging Handbook

(order number 240800) describes Intel’s thermal

impedance test methodology. The

Components

Quality and Reliability Handbook (order number

210997) provides quality and reliability information.

7.0 DESIGN CONSIDERATIONS

To be supplied.

8.0

DEVICE ERRATA

There are no known device errata at this time.

9.0 DATASHEET REVISION HISTORY

This datasheet is valid for devices with an “A” at the

end of the topside field process order (FPO)

number. Datasheets are changed as new device

information becomes available. Verify with your

local Intel sales office that you have the latest

version before finalizing a design or ordering

devices.

Table 10. Thermal Characteristics

Package Type

AN87C196LA (52-pin PLCC)

42°C/W

15°C/W

NOTES:

JA = Thermal resistance between junction

and the surrounding environment (ambient).

Measurements are taken 1 ft. away from

case in static air flow environment.

JC = Thermal resistance between juction

and package surface (case).

All values of

JA and θJC may fluctuate

depending on the environment (with or with-

out airflow, and how much airflow) and

device power dissipation at temperature of

operation. Typical variations are ± 2°C/W.

Values listed are at a maximum power dissi-

pation of 0.50 W.

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