STF20120C datasheet(3/4 Pages) SMC

3 / 4 page

SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N1367, Rev. -

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

STF20120C(R)

Electrical Characteristics:

* Pulse Width < 300µs, Duty Cycle <2%

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Junction Temperature

-55 to +150

°C

Storage Temperature

Tstg

-55 to +150

°C

Maximum Thermal

Resistance Junction to Case

(per leg)

RθJC

DC operation

5.5

°C/W

Approximate Weight

Case Style

ITO-220AB

Characteristics

Symbol

Condition

Max.

Units

VF1

@ 10A, Pulse, TJ = 25

°C

0.90

Forward Voltage Drop (per

leg)*

VF2

@ 10A, Pulse, TJ = 125

°C

0.72

Reverse Current (per leg)

IR1

@VR = rated VR

TJ = 25 °C

0.7

Reverse Current (per leg) *

IR2

@VR = rated VR

TJ = 125 °C

Junction Capacitance

(per leg)

@VR = 5V, TC = 25 °C

fSIG = 1MHz

550

Voltage Rate of Change

dv/dt

10,000

µs

Clip mounting, the epoxy body away

from the heatsink edge by more than

0.110" along the lead direction.

4500

Clip mounting, the epoxy body is

inside the heatsink.

3500

RSM Isolation Voltage

(t = 1.0 second, R. H. < =30%,

TA = 25 °C)

VISO

Screw mounting, the epoxy body is

inside the heatsink.

1500

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