MBRF2040CT datasheet(3/5 Pages) SMC

3 / 5 page

SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N1534, Rev. -

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

MBRF2040CT

Electrical Characteristics:

Characteristics

Symbol

Condition

Max.

Units

VF1

@ 20A, Pulse, TJ = 25 °C

0.84

Forward Voltage Drop *

VF2

@ 20A, Pulse, TJ = 125 °C

0.72

Reverse Current at DC

condition (per leg)

IR1

@VR = rated VR

TJ = 25 °C

Reverse Current (per leg) *

IR2

@VR = rated VR

TJ = 125 °C

15.0

Junction Capacitance

(per leg)

@VR = 5V, TC = 25 °C

fSIG = 1MHz

400

Typical Series Inductance

(per leg)

Measured lead to lead 5 mm

from package body

8.0

Clip mounting, the epoxy body

away from the heatsink edge by

more than 0.110" along the lead

direction.

4500

Clip mounting, the epoxy body is

inside the heatsink.

3500

RSM Isolation Voltage

(t = 1.0 second, R. H. < =30%,

TA = 25 °C)

VISO

Screw mounting, the epoxy

body is inside the heatsink.

1500

* Pulse Width < 300µs, Duty Cycle <2%

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Junction Temperature Range

-55 to +150

°C

Storage Temperature Range

Tstg

-55 to +150

°C

Maximum Thermal Resistance

Junction to Case(per leg)

RθJC

DC operation

5.0

°C/W

Approximate Weight

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